Systems and methods providing improved calibration of memory control voltage

ABSTRACT

Disclosed are systems and methods of dynamically calibrating a memory control voltage more accurately. According to disclosed implementations, a memory control voltage such as Vpass or Vwlrv may be calibrated during memory operation as a function of the change in slope of total string current, even during increase in the wordline voltage. In one exemplary method, the wordlines are increased in sequence from a start voltage to an end voltage in steps, slope change is measured at every step, the measured slope change is compared against a threshold, and an adjusted memory control voltage is determined as a function of a wordline voltage at which the change in slope reaches the threshold. As such, memory control voltage may be determined and dynamically calibrated with less sensitivity to operating parameters such as temperature, pattern, and/or time of programming.

RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 16/987,316, filed Aug. 6, 2020, which is acontinuation application of U.S. patent application Ser. No. 16/424,448,filed May 28, 2019, issued as U.S. Pat. No. 10,741,260 on Aug. 11, 2020,both entitled “Systems and Methods Providing Improved Calibration ofMemory Control Voltage”, the entire disclosures of which applicationsare hereby incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to multi-level memoryoperation, and more particularly, to systems and methods of dynamicallycalibrating memory control voltage with less sensitivity to fluctuationsin operating parameters such as temperature, pattern, and/or time ofprogramming.

BACKGROUND

Dynamic calibration of pass voltage (Vpass) and wordline read-verifyvoltage (Vwlrv) is performed during certain memory operations, such aspage read, to account for charge loss in distributions with ageing, forexample. Existing systems that dynamically calibrate such voltages oftenperform calibration as a function of the average string current in thememory sub-blocks. Drawbacks of approaches like this can includeundesired sensitivity to temperature changes and/or time of programmingrequirements. For example, since temperature compensation is only doneat the desired sense current or sense Vt (threshold voltage), i.e., thevoltage at which the cells are sensed as erased or programmed,temperature-induced variation of cell current from cells not at sense Vtcan cause inaccuracy in voltage calculation and resulting calibration.Moreover, if different pages or sub-blocks are programmed at differenttimes, inaccurate calibration of dynamic pass voltage or wordlineread-verify voltage may occur due to high currents from unselectedsub-blocks. This is because unselected sub-block segmentation orturn-off cannot be done until the final pass voltage is determined,which happens after the comparator flips indicating completion ofcalibration.

Approaches that dynamically calibrate pass voltage as a function ofcurrent passing through sub-blocks may also suffer from undesiredfluctuation based on the pattern of programming. Here, for example,variation in quantity and/or location of pages programmed may affectcalibration, since the average string current expected is a function ofthe number of pages programmed per block.

The disclosed technology provides improved calibration of pass voltageor wordline read-verify voltage by reducing sensitivity to temperature,pattern, and time of programming issues and/or addressing otherdeficiencies in the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features, and advantages of thedisclosure will be apparent from the following description ofembodiments as illustrated in the accompanying drawings, in whichreference characters refer to the same parts throughout the variousviews. The drawings are not necessarily to scale, emphasis instead beingplaced upon illustrating principles of the disclosure.

FIG. 1 depicts voltage waveforms associated with a memory system knownin the art.

FIG. 2A depicts further voltage waveforms according to according to thememory system known in the art of FIG. 1.

FIG. 2B depicts a circuit diagram representative of the memory systemknown in the art shown in FIGS. 1 and 2A.

FIG. 3 is a block diagram of a memory according to embodiments of thedisclosure.

FIG. 4 depicts voltage waveforms associated with a memory implementationaccording to some embodiments of the disclosure.

FIG. 5 depicts further voltage waveforms associated with a memoryimplementation consistent with FIG. 4 according to some embodiments ofthe disclosure.

FIG. 6A depicts representative circuitry, such as a driver or regulator,associated with a second memory implementation according to furtherembodiments of the disclosure.

FIG. 6B depicts a representative waveform associated with such secondmemory system implementation according to further embodiments of thedisclosure.

FIG. 6C depicts another circuit diagram associated with such secondmemory system implementation according to further embodiments of thedisclosure.

FIG. 7 depicts a representative circuit diagram associated with a thirdmemory implementation according to still further embodiments of thedisclosure.

FIG. 8 depicts an exemplary NAND block diagram according to embodimentsof the disclosure.

DETAILED DESCRIPTION

The following disclosure describes various embodiments of improvedsystems and methods for dynamically calibrating memory control voltages,such as pass voltage and/or wordline read-verify voltage, moreaccurately. According to disclosed implementations, voltages arecalibrated during memory operation based on a change in the curve ofstring current as a function of time, where the change in slope iscalculated from the ratio in change of the total string current over acorresponding change in time, i.e., the rate of change in the totalstring current (also referred to as current ‘roll-off’), as measuredduring increase in wordline voltages, for example. In one exemplarymethod, the wordlines are increased in sequence from a start voltage toan end voltage in steps, the change in slope is measured at every step,the measured slope change is compared against a threshold, and anadjusted/final voltage is determined based on the wordline voltage levelat which the current roll-off reaches (e.g., falls below, etc.) thethreshold. Accordingly, memory control voltage may be determined anddynamically calibrated with less sensitivity to changes in variousoperating parameters, such as fluctuations in temperature, pattern,and/or time of programming.

FIG. 1 depicts voltage waveforms associated with memory systems known inthe art. Graph 100 of FIG. 1 depicts voltage along the vertical or Yaxis 120 against time shown via the horizontal or X axis 110. Referringto FIG. 1, various waveforms are shown, including a pass voltage 130, abitline (BL) voltage 132, a voltage regulation signal (Vreg2) 134 of thebitline pre-charging path, a current limit set for the Vreg2 signaldriver (Ivreg2_lim) 136, a current set equivalent to the average stringcurrent expected (Istring_total) 138, and a slot voltage (Vslot) 140.These waveforms are shown along the time axis 110 as they transitionfrom an initialization stage 112 through several sense stages 114, 116during read operation on the word lines. This known use of varying passvoltage detection, also known as QCL (quick charge loss) tracking usedto predict the shift of distributions downward with ageing, may beperformed in the read operation during increase of the word line basedon comparison of the total string current (Istring_total) 138 and thepull_up current limit, i.e., the set current level limit (Ivreg2_lim)136. Such a scheme relies on the statistical distribution of final-levelcells in a string, e.g., L15 cells for a 4-level NAND, and assuming afully randomized distribution. Of course, for a 3-bit-per-cell device,L7 will be the final level. Here, the current limit set (Ivreg2_lim) 136is equal to the average total string current (Istring_total) 138expected when every string having N/(2{circumflex over ( )}M) cells hasthe desired final pass voltage (VpassR) at its gate, where N is thenumber of wordlines per string and M is the number of levels per page,i.e., 2/4/8 or 16. Here, it is noted that various examples andillustrations herein refer to L15, which assumes that there are 4 levelsin the NAND.

Turning to operation, the wordlines are increased, at 141, from aninitial start voltage (Vstart) 142 to an end voltage (Vend) 146 in stepsin a sequence, at 141. At each step, along 141, total string current iscompared against the set pull_up current limit (Ivreg2_lim) 136associated with the voltage regulation signal (Vreg2) 134. At any givenwordline step, at 141, if the total string current is greater than thecurrent limit set for Vreg2 (i.e., Istring_total>Ivreg2_lim), then thefinal pass voltage (VpassR) is determined as a function of wordlinevoltage at that step. According to some aspects, the selected wordlinevoltage(s) for different levels are adjusted taking into account the QCLdetermined. Further, referring to FIG. 2, since hit_sgs 226 and thefinal pass voltage 228 (VpassR_final), the parameters associated withsub-block segmentation or turn-off (with regard to device reliabilityreasons), cannot be determined until the comparator flips, unselectedsub-block segmentation cannot be done until the final pass voltage 148is determined.

FIG. 2A depicts further waveforms reflecting the distribution of cellsaccording to an illustrative QLC or quad-level cell (4-bit-per-cell),i.e., L0 to L15, memory system, such as described in connection withFIG. 1. With regard to TLC or triple-level cell (3-bit-per-cell)devices, similar waveforms and characteristics would apply for L0 to L7.Graph 200 of FIG. 2A depicts number of cells at each voltage for eachlevel along the vertical or Y axis 220 against voltage shown via thehorizontal or X axis 210. Referring to FIG. 2A, distributions of eachlevel are shown, namely waveforms 222A . . . 222P, e.g., for the seriesof sixteen levels, L0 through L15. FIG. 2A also includes a stringcurrent (Istring_total) waveform 234 showing the total string currentexpected as the wordline voltages are stepped from Vstart to Vend, aswell as points along the X axis where certain levels, e.g. correspondingto voltage steps shown in FIG. 1, occur in connection with thedistribution of one such memory level, L15. With regard to the waveform222P of level L15, FIG. 2A shows the cell quantity when the startvoltage 142 occurs, when the hit_sgs 144 occurs, when the final passvoltage (VpassR_final) 148 occurs, and when the end voltage (Vend) 146occurs. Here, since hit_sgs 144 and the final pass voltage(VpassR_final) 148 cannot be determined until the comparator flips orcalibration is finished, unselected sub-block segmentation or turn-offcannot be done until the final pass voltage (VpassR_final) isdetermined, at 148. Further, cell current variation with temperature cancause a variation or inaccuracy in the final pass voltage (VpassR_final)148 or wordline read-verify voltages calculated, since temperaturecompensation is only performed at the desired sense current. Further, ifdifferent pages or sub-blocks are programmed at different times, ongoingcalibration of the pass voltage (VpassR) and/or the wordline read-verifyvoltages (vwlrv) may also be inaccurate due to high currents fromunselected sub-blocks during calibration. The average string currentexpected is also a function of the number of pages programmed per block,discussed further in connection with FIG. 2B.

FIG. 2B depicts a partial circuit diagram representative of the knownmemory systems described in connection with FIGS. 1-2A. The circuitdiagram of FIG. 2B shows a memory block 300 that includes a first seriesor string of memory cells 310 that have a string current (Istring) 234,a second series or string of memory cells 320 that have a string current325, and the pass voltages (Vpassrf) 312A . . . 312H being supplied tothe series of cells. FIG. 2B illustrates differences in cell pattern,here, where the first string 310 contains only one L15 cell, while thesecond string 320 contains two L15 cells. Here, then, as the number ofL15 cells per strings vary, the current contribution per string changes.In the illustrated example, the average expected string current may becalculated as the total string current (sum of the current in bothstrings) divided by 2 (total number of strings). Further, since thecurrent of the strings 310,320 will decrease as a function of a greaterquantity of L15 cells being programmed per string (i.e., via transistorstriggered by VpassR), the current of each string is based on thequantity of pages being programmed. Here, the average string currentexpected is also a function of the number of pages programmed per block.Further, this dependency helps show how fluctuation in cell currents canaffect calibration efforts. For example, if different pages orsub-blocks are programmed at different times, ongoing calibration of thepass voltage (VpassR) and/or the wordline read-verify voltages (vwlrv)may also be inaccurate due to high currents from unselected sub-blocks,which can result in unsatisfactory average expected string currentcalculation and resulting calibration/performance.

FIG. 3 is a block diagram 330 of a memory 340 according to embodimentsof the disclosure. The memory 340 includes a memory array and arraycircuitry 350 with a plurality of memory cells that are configured tostore data. The memory cells may be accessed in the array through theuse of various signal lines, for example, global word lines (GWLs),local word lines (LWLs), and bitlines (BLs). The memory cells may benon-volatile memory cells, such as NAND or NOR flash cells, phase changememory cells, or may generally be any type of memory cells. The memorycells may be single level cells configured to store data for one bit ofdata. The memory cells may also be multi-level cells configured to storedata for more than one bit of data.

Commands, address information, and write data may be provided to thememory 340 as sets of sequential input/output (I/O) transmitted via I/Ocircuitry 360. Similarly, read data may be provided from the memory 340through the I/O circuitry 360. The I/O circuitry 360 may route datasignals, address information signals, and other signals between an I/Obus and internal buses and registers such as a command register and anaddress register, which may be provided address information by the I/Ocircuitry to be temporarily stored.

The memory 340 also includes control circuitry 370 that receives anumber of control signals either externally (e.g., CE#, CLE, ALE, CLK,W/R#, and WP#) or through a command bus to control the operation of thememory 340. The command register stores information received via the I/Ocircuitry and provides the information to the control circuitry 370. Thecontrol circuitry 370 may be configured to provide internal controlsignals to various circuits of the memory 340. For example, responsiveto receiving a memory access command (e.g., read, write, program), thecontrol circuitry 370 may provide internal control signals to controlvarious memory access circuits to perform a memory access operation. Thevarious memory access circuits are used during the memory accessoperation, and may generally include circuits such as row and columndecoders, charge pump circuitry 380, signal line drivers, data and cacheregisters, I/O circuits, as well as others.

The memory array and array circuitry 350 is coupled to the addressregister, which provides block-row address signals to a row decoder andcolumn address signals to a column decoder. The row decoder and columndecoder of the memory array and array circuitry 350 may be used toselect blocks of memory cells for memory operations, for example, read,program, and erase operations. The row decoder and/or the column decodermay include one or more signal line drivers configured to provide abiasing signal to one or more of the signal lines in the memory array.The signal line drivers may drive the signal lines with a pumped voltagethat is provided by charge pump circuitry 370. The charge pump circuitry370 may provide different voltages used during operation of the memory340, for example, during memory access operations. The voltages providedby the charge pump circuitry 340 may include voltages that are greaterthan a power supply voltage provided to the memory 340, voltages thatare less than a reference voltage (e.g., ground) provided to the memory340, as well as other voltages.

FIG. 4 depicts voltage waveforms associated with a memory systemaccording to some embodiments of the disclosure. Graph 400 of FIG. 4depicts voltage along the vertical or Y axis 120 against time shown viathe horizontal or X axis 110. Referring to FIG. 4, various waveforms areshown, including a pass voltage 430 applied to all the wordlines, abitline voltage (BL) 432, a voltage regulation signal (Vreg2) 434, i.e.,of the bitline pre-charging path, a total string current (Istring_total)438, a source pull down voltage 442 such as a gate-to-source voltage ofthe pull down device in the source (SRC) or slot voltage regulator,Vgs_srcpd, which sinks the total string current, and a slot voltage(Vslot) 440. An exemplary slot or source voltage regulator is shown inFIG. 6A. These waveforms are shown along the time axis 110 as theytransition from an initialization stage 412 through several sense stages414, 416 during read operation on the word lines. Turning to operation,the wordlines are increased, at 441, from an initial start voltage(Vstart) 442 to an end voltage level (Vend) 446 in steps in a sequence,at 441. The slope change in regard to total string current, according tovarious innovations herein, is measured at every step and comparedagainst a threshold, such as a predetermined threshold, to determine thefinal pass voltage (VpassR_final) based on the wordline voltage at whichthe change in total string current (delta_Istring_total) reaches (e.g.,falls below) the threshold, as detailed further in connection with FIG.5.

Accordingly, dynamic pass voltage detection, or QCL tracking, consistentwith the disclosed innovations is performed in the read operation duringincrease of the word line, though based on detecting the total stringcurrent roll-off. Since detection accuracy of the present innovationsrelies on detecting the current slope change, rather than averagecurrent, prior cell current temperature compensation issues have noimpact on accuracy. Further, reliance on detecting such current slopechange enables aspects of the present innovations to be insensitive toother factors, such as one or more of quantity of pages programmed,sample size, and/or differing delay such as time-dependence onprogramming speed.

FIG. 5 depicts a graph 500 of voltage waveforms associated with a memoryimplementation consistent with FIG. 4, according to some embodiments ofthe disclosure. Graph 500 of FIG. 5 shows a bell-shaped waveform 501 ofthe L15 level distribution, a waveform of the string current 534, thechange regarding total string current 536, a threshold 523 against whichthe change regarding total string current is compared, as well as thepoints in time at which the start voltage(s) 524, the hit_sgs voltage526, the final pass voltage (VpassR) 528, and the end voltage (Vend)530, of the wordline as it is increased (i.e., along 441), occur. As setforth above, the wordlines are increased from a predetermined startvoltage (Vstart) 524, to an end voltage (Vend) 530 in steps along asequence, at 441. The change in total current, or roll-off, 536 isdetermined by measuring slope change at every step and comparing thecalculated value against the threshold 523 to determine the final passvoltage (VpassR_final) based on the wordline voltage at which theroll-off (delta_Istring_total) reaches (e.g., falls below) the threshold523, as shown at 537 in FIG. 5. Again, here, use of the changing inslope of the string current 536 enables aspects to be insensitive toother factors, such as quantity of pages programmed, sample size, ortime-dependence of programming.

Additionally, in further embodiments, the change in slope (delta) orroll-off of the total string current may be obtained or measured indifferent ways to even further enhance performance under certainconditions.

FIG. 6A depicts representative circuitry 600 of a Vslot (or Vsrc) driveror regulator that sinks the total string current, as associated with asecond such memory implementation of the disclosure. In particular, FIG.6A illustrates one possible implementation wherein the roll-off ismeasured only for the first few strings closer to the string driver,such as the first ˜2 Kb strings closer to the string driver. Here, forexample, such roll-off is measured by looking at Vgs_srcpd changes asthe wordline steps from Vstart to Vend. FIG. 8 depicts an exemplary NANDblock diagram that helps illustrates aspects of such features. FIG. 8illustrates blocks of memory cells 810A . . . 810 n, an associatedstring driver 820, as well as sub-blocks closer to the string driver820, such as those within an “X” 825 distance, ratio or other measurerelative to the string driver or to total length, L. In furtherembodiments, the roll-off may be measured only for the first few stringscloser to the string driver. In one example, the roll-off may bemeasured for about ¼ or 25% of the strings closest to the driver. Inanother example, the roll-off may be measured for about ¼ of thewordline closest to the string driver. In still another example, theroll-off may be measured for about the first 10% of the strings closerto the string driver. In yet another example, the roll-off may bemeasured for the cells that represent the first ˜10% of the total RCresponse. Turning back to FIG. 6A, the circuitry 600 shown is asub-circuit including an operational amplifier 612 and a transistor paircomprised of a first transistor 616 and a second transistor 618 betweenVsrc and ground, through which the total string current 634 passes. Theoperational amplifier 612 is provided with a first voltage such as areference voltage (e.g., Vdac_src, etc.) at which we want to regulateVslot or Vsrc, on the first node, as well as a second voltage,Vsrc_return, on the feedback node fed back from the Vsrc (or Vslot)grid. In operation, this yields a Vgs_srcpd across the second transistor618 of the transistor pair, which in turn, provides a source voltage(Vsrc) at the output of the memory cell. Here, the total string current634 used to determine slope change will be of reduced size (hence,reduced components and/or complexity), a smaller sum, and thus allow forfaster assessment(s). According to one illustration above, for example,when only 2 KB cells are sensed, total string current is smaller whichmeans lesser Icc. Accordingly, this allows for faster calibrationbecause the associated wordline RC effects are eliminated.

FIG. 6B depicts a representative waveform associated with such secondmemory system implementation according to further embodiments of thedisclosure. Referring to FIG. 6B, Vgs of the source pull down voltage(e.g., Vgs_srcpd) 646 corresponding to the total string current beingdetected is shown mapped against time along the horizontal or X axis andvoltage along the vertical or Y axis. FIG. 6B illustrates the increasein Vgs_srcpd voltage as it is incremented at each time-wise step (t0,t1, t2, t3, t4) associated with the increase in string current uponwhich the slop calculated is based. Here, then, Vgs_srcpd is amplifiedand the rate of change of Vgs is computed to determine where themeasured slope/change 536 reaches (e.g., goes lower than, etc.) thethreshold 523, to determine the final pass voltage (VpassR) and/orwordline read-verify voltages (Vwlrv).

FIG. 6C depicts another circuit diagram 650 illustrative of such secondmemory system implementation according to further embodiments of thedisclosure. The circuit diagram 650 of FIG. 6C depicts representativelogic of an illustrative comparator used to calculate roll-off, showinghow components of Vgs_srcpd 658,662 associated with the strings beingmeasured may be compared via 654, to provide the detected voltage(Vdetect) at output 664. In FIG. 6C, the Vgs_srcpd signal, at 656, isamplified 652 and then switched, at 653, to provide its value at 2 times(tn and tn−1) along lines provided as inputs to the comparator 654. Theoutput of the comparator 654 produces a logic high detect signal(Vdetect) 664, when the Vgs_srcpd switched at (Vgs_srcpd_tn−1) plus thethreshold 523, as indicated in FIG. 6C via (Vgs_srcpd_tn−1)662+Threshold 523 is greater than Vgs_srcpd_tn. Accordingly, systems andmethods consistent with such second implementation are configured tospeed up detection, overcome issues associated with wordline RC(resistive-capacitive) effects, and/or lower the current demand (Icc)utilized in operation.

FIG. 7 depicts a representative circuit diagram 700 associated with athird memory implementation according to still further embodiments ofthe disclosure. The circuit diagram 700 of FIG. 7 illustrates variouscomponents consonant with FIG. 6A, including: an initial operationalamplifier 712 provided with a first voltage 722, such as a sourcevoltage (Vdac_src), at the first (reference) terminal and a secondvoltage 724, such as a source/return voltage (Vsrc_return) at thefeedback node tapped off the SRC grid, at the second terminal; atransistor pair 716,718; and an output 728 providing the source voltage.In general, each string contributes a current which is dependent on thenumber of highest-level cells (e.g., L15 or L7, etc.), and total stringcurrent 734 would be the sum of currents passing through all thestrings. According to the third implementation depicted in FIG. 7,however, the circuitry 700 further includes a flash ADC(analog-to-digital converter) module 750 to detect the slope change andprovide an associated digital output, at 752, for subsequent processing.In the example circuitry 700 shown, the string current (Istring_total)734 associated with the source pull-down voltage (e.g., Vgs_srcpd)measured may be amplified, e.g., via transistors 718,742 and 740, andthe corresponding amplified analog signals are provided, at 746, througha resistor to the flash ADC 750. In operation, a digital code isgenerated for every current via the ADC 750 and the difference ofdigital codes is used to determine roll-off.

The subject matter disclosed above may, however, be embodied in avariety of different forms and, therefore, covered or claimed subjectmatter is intended to be construed as not being limited to any exampleembodiments set forth herein; example embodiments are provided merely tobe illustrative. Likewise, a reasonably broad scope for claimed orcovered subject matter is intended. Among other things, for example,subject matter may be embodied as methods, devices, components, orsystems. Accordingly, embodiments may, for example, take the form ofhardware, software, firmware or any combination thereof (other thansoftware per se). The following detailed description is, therefore, notintended to be taken in a limiting sense.

Throughout the specification and claims, terms may have nuanced meaningssuggested or implied in context beyond an explicitly stated meaning.Likewise, the phrase “in one embodiment” as used herein does notnecessarily refer to the same embodiment and the phrase “in anotherembodiment” as used herein does not necessarily refer to a differentembodiment. It is intended, for example, that claimed subject matterinclude combinations of example embodiments in whole or in part.

In general, terminology may be understood at least in part from usage incontext. For example, terms, such as “and”, “or”, or “and/or,” as usedherein may include a variety of meanings that may depend at least inpart upon the context in which such terms are used. Typically, “or” ifused to associate a list, such as A, B or C, is intended to mean A, B,and C, here used in the inclusive sense, as well as A, B or C, here usedin the exclusive sense. In addition, the term “one or more” as usedherein, depending at least in part upon context, may be used to describeany feature, structure, or characteristic in a singular sense or may beused to describe combinations of features, structures or characteristicsin a plural sense. Similarly, terms, such as “a,” “an,” or “the,” again,may be understood to convey a singular usage or to convey a pluralusage, depending at least in part upon context. In addition, the term“based on” may be understood as not necessarily intended to convey anexclusive set of factors and may, instead, allow for existence ofadditional factors not necessarily expressly described, again, dependingat least in part on context.

Those skilled in the art will recognize that the methods and devices ofthe present disclosure may be implemented in many manners and as suchare not to be limited by the foregoing exemplary embodiments andexamples. In other words, aspects/elements can be performed by single ormultiple components, in various combinations and/or sub-combinations,and individual aspects, may be distributed among components and/orsubcomponents. In this regard, any number of the features of thedifferent embodiments described herein may be combined into single ormultiple embodiments, and alternate embodiments having fewer than, ormore than, all the features described herein are possible.

While various embodiments have been described for purposes of thisdisclosure, such embodiments should not be deemed to limit the teachingof this disclosure to those embodiments. Various changes andmodifications may be made to the elements and features described aboveto obtain a result that remains within the scope of the systems andprocesses described in this disclosure.

What is claimed is:
 1. A device, comprising: a plurality of memorycells; and circuitry coupled to the memory cells and configured to:drive a voltage applied on the memory cells in increments; determine afirst current passing through the memory cells responsive to a firstincrement being applied to the voltage; determine a second currentpassing through the memory cells responsive to a second increment beingapplied to the voltage following the first increment; and determine aparameter to read the memory cells based on the voltage driven on thememory cells and identified via the second increment in response to achange from the first current to the second current falling below athreshold.
 2. The device of claim 1, wherein the driven voltage isassociated with a read operation of the memory cells.
 3. The device ofclaim 1, wherein the memory cells are arranged as a string connected inseries.
 4. The device of claim 3, further comprising an operationalamplifier coupled to a reference voltage.
 5. The device of claim 3,wherein the circuitry further comprises: one or more transistors coupledto a slot voltage of the memory cells and configured to amplify a readcontrol current of a source pull down; and an analog-to-digitalconverter coupled to the one or more transistors to receive an amplifiedcurrent, and compute a digital code based on the amplified current todetect the change.
 6. The device of claim 1, wherein the circuitrycomprises an operational amplifier configured to receive a source pulldown voltage as an input and generate an output to detect the change. 7.The device of claim 1, wherein the first current is a sum of stringcurrents of memory sub-blocks.
 8. The device of claim 7, wherein thememory sub-blocks are 2,000 or less of byte strings closest to a stringdriver.
 9. A memory device, comprising: a memory array including memorycells; wordlines connected to the memory cells; and circuitry configuredto: drive a voltage on the wordlines in increments; determine a firststring current passing through the memory cells responsive to a firstincrement being applied to the voltage; determine a second stringcurrent passing through the memory cells responsive to a secondincrement being applied to the voltage following the first increment;and determine a parameter to read the memory cells based on detecting achange from the first string current to the second string currentfalling below a threshold.
 10. The memory device of claim 9, wherein theparameter is determined during a memory operation, and the memoryoperation is associated with reading the memory array.
 11. The memorydevice of claim 10, further comprising a first operational amplifiercoupled to a reference voltage associated with the memory array.
 12. Thememory device of claim 11, wherein the circuitry comprises a secondoperational amplifier configured to receive a source pull down voltageas an input and generate an output to detect the change.
 13. The memorydevice of claim 9, wherein the memory cells are NAND memory.
 14. Thememory device of claim 9, wherein the first string current is a sum ofstring currents of memory sub-blocks.
 15. The memory device of claim 14,wherein the memory sub-blocks are no more than 2,000 of strings that areclosest to a string driver in the memory array.
 16. The memory device ofclaim 9, wherein the circuitry comprises: one or more transistorscoupled to a slot voltage of the memory cells and configured to amplifya read control current of a source pull down; and a flashanalog-to-digital converter coupled to the one or more transistors toreceive an amplified current and compute a digital code based on theamplified current to detect the change.
 17. A device, comprising: atleast one memory array of memory cells connected in a plurality ofstrings, the memory array having a plurality of wordlines; circuitrycoupled to the wordlines and configured to: apply a series of voltagesteps to increase voltages on the wordlines; at each of the voltagesteps, determine a sum of currents in a set of strings of the memoryarray, and compare a change in slope of the sum of currents over timeagainst a threshold; and determine a control voltage for a wordline inthe memory array based on a voltage applied on the wordline at a timewhen the change falls below the threshold.
 18. The device of claim 17,wherein the set of strings includes no more than 10 to 25 percent of theclosest strings of the memory array to a string driver.
 19. The deviceof claim 17, wherein the memory cells are NAND memory.
 20. The device ofclaim 17, wherein the circuitry comprises an analog-to-digital converterconfigured to receive an amplified current and compute a digital codebased on the amplified current to detect the change.